Alexander Lunt (EP/UCM)
I am currently a senior fellow at CERN who is responsible for managing and operating the new Zeiss XB540 Focused Ion Beam (FIB) / Scanning Electron Microscope (SEM) laboratory. The laboratory has been designed to facilitate high resolution (nanoscale) imaging and manipulation (milling and deposition) of a broad range of samples. I collaborate closely with many departments within CERN and perform studies on a diverse range of samples including thin films, pressure vessels, bulk assemblies, electrical components, insulating materials, beam interaction samples… to name a few.
My background is based in materials engineering and I have recently (May 2016) finished my PhD at the University of Oxford. My thesis was entitled:
“Mechanical Microscopy of the Interface between Yttria-Partially-Stabilised Zirconia and Porcelain in Dental Prostheses.”
I have a broad range of academic interests however these can primarily be grouped into two main categories:
- Synchrotron and neutron spallation research
- Strain mapping, tomography, SAXS, WAXS, PDF analysis, SANS and WANS.
- Microscopy and nanomechanics
- SEM, FIB techniques, EDS, EBSD, STEM, TEM, nanoindentation, micropillar compression and splitting.
A list of my publications can be found on my google scholar page: https://scholar.google.ch/citations?user=GyD6CCMAAAAJ&hl=en
My ResearchGate profile can be found here: https://www.researchgate.net/profile/Alexander_Lunt
My LinkedIn profile can be found here: https://ch.linkedin.com/in/alexanderlunt
Please send me an email for a copy of my CV if you are interested.
The XB540 FIB/SEM Laboratory
A recent article about the XB540 FIB/SEM laboratory can be found here: http://home.cern/cern-people/updates/2017/07/microscope-digs-deep-answers
The current system is capable of performing:
- A broad range of SEM and FIB imaging techniques including:
- Secondary Electron Secondary Ion (SESI) imaging for conventional sample imaging
- InLens secondary electron imaging for high resolution (0.8 nm) imaging.
- Energy selective Backscattered (EsB) imaging for threshold variable backscattered imaging.
- A 4 quadrant BackScattered Detector (BSD) to facilitate topographical and elemental contrast imaging.
- Scanning Transmission Electron Microscopy (STEM) for very high resolution imaging (0.1 nm) of Transmission Electron Microscopy (TEM) lamellas.
- A 4 axis Kleindiek micromanipulator for TEM lamella preparation and microscale manipulation.
- An Oxford instruments Silicon Drift Detector (SDD) – Xmax 50 mm2 for Energy Dispersive X-ray (EDX) spectroscopy. Potential capabilities include:
- Line, point and 2D surface mapping of elemental variation.
- Transmission EDX of TEM lamellas for high resolution analysis.
- Multi-layer thin film characterisation.
- A gallium FIB source to facilitate:
- Microscale cross sectional milling and surface treatment.
- Platinum and carbon deposition through 2 independent gas injection systems.
- 3D FIB tomography to reveal insight into the complete elemental and microstructural variation inside a microscale gauge region.
- Microscale residual stress analysis using the ring-core FIB milling and digital image correlation technique (http://sdj.sagepub.com/content/50/7/426).
- ATLAS 5
- For large area (up to cm) high resolution SEM imaging and automated stitching.
Within the laboratory we also have facilities for sample preparation including:
- A Gatan Ilion+ II ion polishing machine for preparing high quality cross sections and planar milling
- An Agar Scientific Low speed diamond saw for gentle sample sectioning
- A well-equipped sample mounting workstation
Please get in touch if you have any requests or questions.
Last update: 14 May 2019